// QC

QUALITY CONTROL

QUALITY CONTROL

Strict quality control, process management and meticulous attention to detail are our absolute business core. A system-based inspection process ensures that supplied components fully meet customer standards, and we can achieve high standards of quality control by accurately following the set process every day. 

Step 1:External Visual Inspection

For all incoming goods will pass visual inspection, and the inspection recorded.visual inspection to verification the parts if are original, new and unused.marking permanency and resistance to solvents, resurfacing, demension verification, marking code matching, high-power magnification inspection of body and terminal condition are standard methods within our inspection process. all inspections and observations are reviewed by our quality engineers to evaluate whether we are seeing a new counterfeiting technique or manufacturing ANAMOLY.Testing of manufacturer, material part number, quantity, date code and environmental protection standard.    1. Screen printing (Marking) inspection, consistency inspection, verification of the original factory specifications, specification documents. 2. Inspection on material appearance, dust condition, Pin foot deformation, Pin foot  oxidation. 3. Check the HS code, must be consistent with invoice/packing list. Recheck all materials that found  possible unqualified during step 1, or the supplier channel is not a“Tier 1 supplier class.The supplied materials must be re-inspected by the quality inspection department.

Step 2:QC Inspector Recheck  

Step 3:Quality testing  

1.Solderability test.

2. D-CAP analysis

3.  Cross-section analysis

4.  Electrical conformance Test

Step 4:EMMI (Element Light Microscopy) to analysis content and test pictures

Check content:

1. P-N junction leakage; P-N junction collapse

2. Hot electrons of transistors in the saturation region

3. Photon excitation generated by oxide layer leakage current

4. Latch up, Gate Oxide Defect, Junction Leakage, Hot Carriers Effect, ESD, etc.

Step 5:Document Management

1.Quality Control list, detailed record of the information incoming goods

2.Keep the samples on file

3.incoming goods are photographed and filed

4.shipped goods are photographed and filed

5.File the non-conforming goods ,request the supplier submits the corresponding supplier audit 1 classification management system process

6.File the Quality test analysis tools/reports

7.File the contact information of the original factory

Test Project

X-ray inspection

X-ray inspection is an internal component inspection based on the image obtained via an x-ray machine, this will be an inspection of the short/open circuit inside components under tests.X-RAY equipment can confirm the suitability of wafer, wire bond and die bond. The picture above is a product inspection picture taken by X-RAY. We will filter out such products when inspecting the internal structure through 1000 times magnified X-RAY. Afterwards, we perform proper functional tests on other products that are in good condition. In the end, we provide our customers with quality parts.

Program testing

Program testing is to test whether the components are blank or not. non-programming and its usability. mainly applies in the otp. eprom and eeprom etc. the type of storage for components testing.In addition, we do storage capacity test for digital memory and flash memory, to ensure the correct read and write of the chip internal storage.

Soderability testing

Solderability testing helps determine if a component provides the level of wetting required for a secure solder connection. A poor test result indicates a poor connection. This will caused components not be able to solder to the board.If you don't do this test, you may need to reconnect. Solderability is a test to determine if the components will have soldering issue at the contract manufacturer. 

Test Equipments:

Quality testing equipments includes the following types:

1.FA part is commonly used, DC source meter, display oscilloscope, multimeter, parameter analyzer, LCR analyzers, and optical microscope;

2.Reliability instrument,vector network analyzer,signal generator, data acquisition, withstand voltage tester etc. 

3.A professional testing machine line of passive semiconductor:Eight temperature zone tunnel furnace/0-1000v coil interlayer tester/Pressure tester/0.01mΩ precision milliohm meter/60A superimposed current tester/Thermal shock testing machine/Microscope/1MHz LCR Tester/Thermal shock testing machine